Bunda bonce
Wannan jerin gwanon lu'u-lu'u an yi amfani da shi ne kawai don dawo da thinning da kuma daidaitaccen aiki na silsortor, kuma raw silicon sons.
Resin bond baya
Resin bunkulan rike da nika wanda aka yi daga reson thermoset resin da lu'u-lu'u, wanda Arenende, Gallium Arenide.
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Abvantbuwan amfãni na baya da dabarun niƙa
1. Tare da ƙarancin lalacewa da inganci
2.Ka amfani da aiki mai gudana ne ta mafi girman kaifi
3. Yana taimaka rage rage girman sarrafawa, haɓaka ingancin sarrafawa da rage farashin sarrafawa, kuma an tsara shi bisa ga bukatun abokin ciniki
1.Aplications na baya na grinding wheg:
Komawa Thinning, gaba mai kyau da kyau nika na na'urori masu hankali, hade da kewaye siliki wa wafers, da sauransu kwakwalwan kwamfuta, da sauransu
2
3. Kayan kayan aiki: kayan aiki na kayan aiki: silicon, gallisidededededede, phosphide phosphide da sauran kayan silonductor.
4. Aikace-aikace: Bayar Thinning, m nika da kyau nrinding
Daraja mai nika ta baya: Za a iya amfani da ƙafafun da ke cikin Jafananci don Jamus, Jamus, Koriya, Engis, Disamoto, Disamoto, Gisoug, TSK da Straspugh Rage injin, da sauransu).
